PACKAGE WITH CATHODIC PROTECTION FOR CORROSION MITIGATION

An apparatus is provided which comprises: a substrate to couple with one or more integrated circuit die(s), an integrated circuit die coupled to the substrate, a metal component coupled to the substrate, wherein the metal component lacks a sealing coating, and a sacrificial metal conductively couple...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yazzie, Kyle, Mamodia, Mohit
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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