PACKAGE WITH CATHODIC PROTECTION FOR CORROSION MITIGATION

PACKAGE WITH CATHODIC PROTECTION FOR CORROSION MITIGATION

An apparatus is provided which comprises: a substrate to couple with one or more integrated circuit die(s), an integrated circuit die coupled to the substrate, a metal component coupled to the substrate, wherein the metal component lacks a sealing coating, and a sacrificial metal conductively couple...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Yazzie, Kyle, Mamodia, Mohit
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An apparatus is provided which comprises: a substrate to couple with one or more integrated circuit die(s), an integrated circuit die coupled to the substrate, a metal component coupled to the substrate, wherein the metal component lacks a sealing coating, and a sacrificial metal conductively coupled with the metal component, wherein the sacrificial metal comprises a more anodic metal than the metal component. Other embodiments are also disclosed and claimed.