PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRODUCING METHOD THEREOF

A pressure-sensitive adhesive composition includes a block copolymer containing a polymer block (A) and a (meth)acrylic polymer block (B), wherein the polymer block (A) contains either or both of a maleimide compound and an amide group-containing vinyl compound as a constitutional monomer thereof an...

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Bibliographische Detailangaben
Hauptverfasser:	SHIBATA, Akitsugu, KAAI, Michihiro, NAKAMURA, Kenichi
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A pressure-sensitive adhesive composition includes a block copolymer containing a polymer block (A) and a (meth)acrylic polymer block (B), wherein the polymer block (A) contains either or both of a maleimide compound and an amide group-containing vinyl compound as a constitutional monomer thereof and has a glass transition temperature of 100° C. or higher, and the (meth)acrylic polymer block (B) contains at least one selected from compounds represented by general formula (1) as a major constitutional monomer thereof and has a glass transition temperature of 10° C. or below.CH2═CR1-C(═O)O(R2O)n-R3 (1)(wherein, R1 represents hydrogen or a methyl group; R2 represents a linear or branched C2-6 alkylene group; R3 represents hydrogen, a C1-20 alkyl group, or a C6-20 aryl group; and n represents 0 or an integer from 1 to 100.)