UNITARY MOLDED USB DEVICE

A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.

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Bibliographische Detailangaben
Hauptverfasser:	Rai, Pradeep Kumar, Guan, Tee Khoon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.