METHODS OF FORMING GATE CONTACT OVER ACTIVE REGION FOR VERTICAL FINFET, AND STRUCTURES FORMED THEREBY

Methods of making a vertical FinFET device having an electrical path over a gate contact landing, and the resulting device including a substrate having a bottom S/D layer thereover and fins extending vertically therefrom; a bottom spacer layer over the bottom S/D layer; a HKMG layer over the bottom...

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Bibliographische Detailangaben
Hauptverfasser: Soss, Steven R, Zang, Hui, Xie, Ruilong
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Methods of making a vertical FinFET device having an electrical path over a gate contact landing, and the resulting device including a substrate having a bottom S/D layer thereover and fins extending vertically therefrom; a bottom spacer layer over the bottom S/D layer; a HKMG layer over the bottom spacer layer; a top spacer layer over the HKMG layer; a top S/D layer on top of each fin; top S/D contacts formed over the top S/D layer; an upper ILD layer present in spaces around the top S/D contacts; an isolation dielectric within a portion of a recess of top S/D contacts located above adjacent fins; a gate contact landing within a remaining portion of the recess; a gate contact extending vertically from a bottom surface of the gate contact landing and contacting a portion of the HKMG layer; and an electrical path over at least the gate contact landing.