THREE-DIMENSIONAL CIRCUIT STRUCTURE

A three-dimensional (3D) circuit structure includes a 3D insulating substrate having at least one circuit forming zone and at least one exposed contact forming zone; at least one circuit pattern portion provided on the 3D insulating substrate and having at least one circuit trace layout layer located in the circuit forming zone and at least one exposed contact located in the exposed contact forming zone and connected to the circuit trace layout layer; and an insulating encapsulation member covering at least the circuit forming zone and the circuit trace layout layer. With the insulating encapsulation member, the circuit trace layout layer is waterproof, dustproof, scratch-resistant, peeling-proof, secure for use, and compliant with safety codes of electrical insulation, enabling the 3D circuit structure in use to have stable electrical characteristics.