HETEROGENEOUS COMMON SUBSTRATE MULTI-CHIP PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT AND DIGITAL SIGNAL PROCESSOR

An optical transceiver package comprising a transceiver module, a digital signal processor (DSP), a substrate supporting the transceiver module and the DSP, and a barrier to mechanically protect and thermally insulate the transceiver module. The substrate comprises a material having a coefficient of...

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Hauptverfasser:	Zhang, Jiaming, Han, Xiaofeng, Osenbach, John, Butrie, Timothy, Kish, JR., Fred
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS TRANSMISSION
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creator	Zhang, Jiaming Han, Xiaofeng Osenbach, John Butrie, Timothy Kish, JR., Fred
description	An optical transceiver package comprising a transceiver module, a digital signal processor (DSP), a substrate supporting the transceiver module and the DSP, and a barrier to mechanically protect and thermally insulate the transceiver module. The substrate comprises a material having a coefficient of thermal expansion (CTE) of 2.3-14 ppm/° C. and the barrier comprises a material having a CTE of 3.5-14 ppm/° C.
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subjects	ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS TRANSMISSION
title	HETEROGENEOUS COMMON SUBSTRATE MULTI-CHIP PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT AND DIGITAL SIGNAL PROCESSOR
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