HETEROGENEOUS COMMON SUBSTRATE MULTI-CHIP PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT AND DIGITAL SIGNAL PROCESSOR

HETEROGENEOUS COMMON SUBSTRATE MULTI-CHIP PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT AND DIGITAL SIGNAL PROCESSOR

An optical transceiver package comprising a transceiver module, a digital signal processor (DSP), a substrate supporting the transceiver module and the DSP, and a barrier to mechanically protect and thermally insulate the transceiver module. The substrate comprises a material having a coefficient of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Zhang, Jiaming, Han, Xiaofeng, Osenbach, John, Butrie, Timothy, Kish, JR., Fred
Format: Patent
Sprache:eng
Schlagworte:
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
TRANSMISSION
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Beschreibung
Zusammenfassung:An optical transceiver package comprising a transceiver module, a digital signal processor (DSP), a substrate supporting the transceiver module and the DSP, and a barrier to mechanically protect and thermally insulate the transceiver module. The substrate comprises a material having a coefficient of thermal expansion (CTE) of 2.3-14 ppm/° C. and the barrier comprises a material having a CTE of 3.5-14 ppm/° C.