HIGH FREQUENCY BGA CONNECTOR

A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configure...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Johnson, Lewis Robin, Rengarajan, Madhumitha
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.