APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
An apparatus for processing a substrate includes a process chamber, a support unit that supports the substrate in the process chamber, a gas supply unit that supplies a process gas, and a plasma source that generates plasma from the process gas. The support unit includes an electrostatic chuck, and...
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| creator | JUNG, KYUNGHWA LEE, JUNG HWAN |
| description | An apparatus for processing a substrate includes a process chamber, a support unit that supports the substrate in the process chamber, a gas supply unit that supplies a process gas, and a plasma source that generates plasma from the process gas. The support unit includes an electrostatic chuck, and the apparatus further includes a power supply that supplies a chucking voltage to the electrostatic chuck and a management unit that feedback controls a voltage applied to the power supply for each process and controls a heat transfer gas flow supplied between the substrate and the electrostatic chuck. The management unit includes a first monitoring unit that monitors a physical property change of the substrate. The management unit includes a first controller that performs control to compensate for the chucking voltage by feeding back a chucking force value corresponding to a preset reference value based on the monitored property changes. |
| format | Patent |
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The support unit includes an electrostatic chuck, and the apparatus further includes a power supply that supplies a chucking voltage to the electrostatic chuck and a management unit that feedback controls a voltage applied to the power supply for each process and controls a heat transfer gas flow supplied between the substrate and the electrostatic chuck. The management unit includes a first monitoring unit that monitors a physical property change of the substrate. 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The support unit includes an electrostatic chuck, and the apparatus further includes a power supply that supplies a chucking voltage to the electrostatic chuck and a management unit that feedback controls a voltage applied to the power supply for each process and controls a heat transfer gas flow supplied between the substrate and the electrostatic chuck. The management unit includes a first monitoring unit that monitors a physical property change of the substrate. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | APPARATUS AND METHOD FOR PROCESSING SUBSTRATE |
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