HOUSING FOR MOUNTING OF COMPONENTS IN HEAD MOUNTED DISPLAY

A housing, including mounting features for directly mounted components, is formed by curing carbon fiber reinforced polymer (CFRP) and a molding compound (MC) such as a sheet molding compound (SMC) or a bulk molding compound (BMC). SMC or BMC may be used depending on the implementation. This forms a...

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Bibliographische Detailangaben
Hauptverfasser:	LAFORD, Marianne Elizabeth, TOLENO, Brian J, NIKKHOO, Michael, TAYLOR, Joseph Daniel, MARKOVSKY, Igor, BEERMAN, Michael Neil
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:	A housing, including mounting features for directly mounted components, is formed by curing carbon fiber reinforced polymer (CFRP) and a molding compound (MC) such as a sheet molding compound (SMC) or a bulk molding compound (BMC). SMC or BMC may be used depending on the implementation. This forms a housing with mounting features in a thermoset manner, in which the weight of a product such as a head mounted display (which incorporates the housing comprising the mounting features) is reduced, and any orientation issues or problems are significantly reduced.