FORMULATION OF MATERIAL FOR OPTIMIZING ADHERENCE WHEN INSULATING WIRES AND PRODUCT PRODUCED THEREFROM

FORMULATION OF MATERIAL FOR OPTIMIZING ADHERENCE WHEN INSULATING WIRES AND PRODUCT PRODUCED THEREFROM

This invention falls within the scope of insulation materials, more particularly of compounds intended for optimizing the adhesion on the insulation of wires used in cars. It is the object of this invention a formulation which comprises, in percentage by weight of the components relative to the tota...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MENESES SALVADA, Rita Alexandra Ascenso, GARRIDO DA COSTA, Tiago José, MORAIS DA CRUS, Joaquim Fernando
Format: Patent
Sprache:eng
Schlagworte:
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Beschreibung
Zusammenfassung:This invention falls within the scope of insulation materials, more particularly of compounds intended for optimizing the adhesion on the insulation of wires used in cars. It is the object of this invention a formulation which comprises, in percentage by weight of the components relative to the total weight of the composition, 10% to 40% of a polyolefin, 40% to 60% of a mineral filler, 1% to 4% of an antioxidant, 1 to 2% of an organosilane, 0.5 to 2.5% of an organic peroxide and 0.1 to 0.5% of erucamide. Additionally, it is also an object of this invention a product obtained by mixing the said formulation and subsequent crosslinking of the same. This formulation allows a compound to be obtained, which complies with the required standards, as well as controls and improves the adhesiveness of the insulating material to the conducting wire, this representing an important aspect on the wiring process.