MANUFACTURING PROCESS OF ELEMENTAL CHIP

A manufacturing process of an elemental chip includes steps of preparing a substrate held on the holding tape, the substrate including first and second sides opposite each other and the second side thereof being held on the holding tape, and the substrate further including a plurality of element regions and a plurality of segmentation regions defining each of the element regions; setting a nozzle to have a length between a lower most edge of the nozzle and the first side of the substrate in a range between 20 mm and 150 mm, spraying a resist solution to form droplets of the resist solution, the resist solution containing a resist constituent and a solvent; forming a resist layer by vaporizing the solvent from the droplets and depositing the resist constituent on the first side of the substrate that is held on the holding tape such that an amount of the solvent remained in the resist layer to be in a range between 5 wt. % and 20 wt. %; patterning the resist layer to expose the first side of the substrate in the segmentation regions; and plasma-etching the first side of the substrate exposed in the segmentation regions thereof.