CONDUCTING HEAT THROUGH A HINGE

Examples are disclosed that relate to heat transfer devices comprising a vapor chamber and a flexible hinge. One disclosed example provides an electronic device comprising a first portion and a second portion connected by a hinge region, and a vapor chamber extending from the first portion to the se...

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Bibliographische Detailangaben
Hauptverfasser:	GHIONI, Lincoln Matthew, HURBI, Erin Elizabeth, DELANO, Andrew Douglas
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	Examples are disclosed that relate to heat transfer devices comprising a vapor chamber and a flexible hinge. One disclosed example provides an electronic device comprising a first portion and a second portion connected by a hinge region, and a vapor chamber extending from the first portion to the second portion across the hinge region, the vapor chamber comprising a first layer comprising titanium, a second layer comprising titanium joined to the first layer to form the vapor chamber, a working fluid within the vapor chamber, and a third layer comprising titanium positioned between the first layer and the second layer, the third layer comprising one or more features configured to conduct the working fluid via capillary action.