METHODS OF FORMING INTEGRATED CIRCUITS HAVING PARALLEL CONDUCTORS

Methods of forming integrated circuits forming a first conductive structure at a first level of the integrated circuit, forming a first conductor at a second level of the integrated circuit to be in physical and electrical contact with the first conductive structure, forming a second conductor at th...

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Bibliographische Detailangaben
Hauptverfasser:	Sipani, Vishal, Yang, Ming-Chuan, Hansen, Tyler G
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Methods of forming integrated circuits forming a first conductive structure at a first level of the integrated circuit, forming a first conductor at a second level of the integrated circuit to be in physical and electrical contact with the first conductive structure, forming a second conductor at the second level to be in physical and electrical contact with the first conductive structure and to be parallel to the first conductor, forming a third conductor at the second level to be isolated from the first conductive structure and to be parallel to the first conductor and to the second conductor, and forming a second conductive structure at a third level of the integrated circuit to be in physical and electrical contact with the second conductor and with the third conductor, wherein the second level is between the first level and the third level.