METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD

The present invention discloses a method of making a printed circuit board comprising the steps of forming a sublayer comprising a combination of alternating copper and insulating layers, which has a first through-hole the internal wall of which is copper electroplated, forming a sublayer attaching...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LEE, Min-Seok, KANG, Dae-Geun, KWON, Jun-Koo, KIM, Dong-Hyun
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention discloses a method of making a printed circuit board comprising the steps of forming a sublayer comprising a combination of alternating copper and insulating layers, which has a first through-hole the internal wall of which is copper electroplated, forming a sublayer attaching structure comprising a hardened (cured) epoxy layer and adhesive films on top of both surfaces of said epoxy layer, which has q second through-hole filled with conducting ink, and (c) laying the sublayer attaching structure in contact between the upper sublayer and lower sublayer in such a way that said first through-hole is aligned with said second through-hole, and performing a complete hardening (curing) process.