METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
A technical concept of the present disclosure provides a method of producing a semiconductor package, the method including operations of: arranging a plurality of wafers on a tray, forming an interconnect structure on the tray and the plurality of wafers, and separating the plurality of wafers from...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A technical concept of the present disclosure provides a method of producing a semiconductor package, the method including operations of: arranging a plurality of wafers on a tray, forming an interconnect structure on the tray and the plurality of wafers, and separating the plurality of wafers from the tray. |
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