SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY

SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY

A reliability cover that is disposed over at least one of an integrated circuit package and a Si die of the integrated circuit package is disclosed. The integrated circuit package is mountable to a printed circuit board via a plurality of solder balls. The reliability cover is configured to reduce a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YU, Lee Kong, CHIN, Yoong Tatt, TEH, Weng-Hong, GILL, Paramjeet Singh, IM, Sungjun, LAU, Chun Sean
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A reliability cover that is disposed over at least one of an integrated circuit package and a Si die of the integrated circuit package is disclosed. The integrated circuit package is mountable to a printed circuit board via a plurality of solder balls. The reliability cover is configured to reduce a difference in a coefficient of thermal expansion between the integrated circuit package and the printed circuit board, and between the Si die and a substrate of the integrated circuit package by a threshold value.