TIGHT TEMPERATURE CONTROL AT A THERMAL LOAD WITH A TWO PHASE PUMPED LOOP, OPTIONALLY AUGMENTED WITH A VAPOR COMPRESSION CYCLE
A two-phase pump loop (TPPL) for dissipating a thermal load during operation of an apparatus includes a coolant, a vapor/liquid receiver, a pump, an evaporator, a condenser, a valve (V1) configured to regulate a pressure at an outlet of the condenser; a valve (V2) having a control set point set equi...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A two-phase pump loop (TPPL) for dissipating a thermal load during operation of an apparatus includes a coolant, a vapor/liquid receiver, a pump, an evaporator, a condenser, a valve (V1) configured to regulate a pressure at an outlet of the condenser; a valve (V2) having a control set point set equivalent to a low pressure (PL) measured in the vapor/liquid receiver; and a controller configured to control the set points of V1 and V2. The TPPL is configured to cool the thermal load with tight control of the temperature of the coolant that is cooling the apparatus. The TPPL may be combined with a vapor cycle system (VCS) to provide a thermal management system with the VCS being configured to use the same or different coolant than the TPPL. |
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