METHOD FOR EMBEDDING ELECTRONICS INTO A PUCK AND PUCK HAVING EMBEDDED ELECTRONICS

A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure havin...

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Bibliographische Detailangaben
Hauptverfasser: HOLZNER, Simon, BOHN, Bernhard Johann
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure having a rigid shell, at least one transmitter circuit supported by the carrier structure, and a battery provided within the carrier structure. The battery is embedded in a first elastic material provided within the carrier structure. The carrier structure is embedded in a second elastic material provided within the centrally located cavity.