METHOD FOR EMBEDDING ELECTRONICS INTO A PUCK AND PUCK HAVING EMBEDDED ELECTRONICS
A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure havin...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure having a rigid shell, at least one transmitter circuit supported by the carrier structure, and a battery provided within the carrier structure. The battery is embedded in a first elastic material provided within the carrier structure. The carrier structure is embedded in a second elastic material provided within the centrally located cavity. |
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