STACKED MEMORY WITH INTERFACE PROVIDING OFFSET INTERCONNECTS

A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the seco...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SCHAEFER, Andre, VOGT, Pete D, HALBERT, John B, MORROW, Warren, KIM, Jin, SHOEMAKER, Kenneth D
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the second face of each memory die layer including an interface for coupling data interface pins of the memory die layer with data interface pins of a first face of a coupled element. The interface of each memory die layer includes connections that provide an offset between each of the data interface pins of the memory die layer and a corresponding data interface pin of the data interface pins of the coupled element.