SEMICONDUCTOR PACKAGE OF USING INSULATING FRAME

A semiconductor package using an insulating frame of various is disclosed. The insulating frame has a through hole therein, and the semiconductor chip is mounted in the through hole. Further, a via hole is provided in the periphery of the through hole, and a via contact filling the via hole is provi...

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Bibliographische Detailangaben
Hauptverfasser:	YOON, Mina, LEE, Junkyu, KWON, Yongtae, LEE, Jaecheon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor package using an insulating frame of various is disclosed. The insulating frame has a through hole therein, and the semiconductor chip is mounted in the through hole. Further, a via hole is provided in the periphery of the through hole, and a via contact filling the via hole is provided. Whereby the pad of the semiconductor chip is electrically connected to the via contact through the distribution layer. Further, an adhesive buffer layer for increasing the adhesive force is introduced into the upper portion of the insulating frame.