SUBSTRATE PROCESSING APPARATUS

A substrate processing apparatus includes: placing table on which a substrate to be processed is placed; suction mechanism including a pipe configured to apply a suction force to a rear surface of the substrate through one or a plurality of hole portions formed in the placing table to hold the subst...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Itonaga, Masashi, Ushimaru, Koji
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A substrate processing apparatus includes: placing table on which a substrate to be processed is placed; suction mechanism including a pipe configured to apply a suction force to a rear surface of the substrate through one or a plurality of hole portions formed in the placing table to hold the substrate; and fluid supply source configured to discharge a fluid to one or a plurality of discharge portions formed in the placing table outward of the hole portions in the placing table and to form a horizontal airflow toward an outside of the substrate on a rear surface of the substrate.