ENCAPSULATING COVER FOR AN ELECTRONIC PACKAGE AND FABRICATING PROCESS

Encapsulating cover for an electronic package is formed by a cover body having a front wall and, positioned around a through-passage, a mounting face that includes a bearing surface. A mounting face of an optical element bears against the bearing surface. The mounting face includes at least one local void that is set back with respect to the bearing surface to provide a space between the mounting face of the optical element and the bottom of the local void. The local void extends beyond an edge of the optical element. A drop of fastening adhesive extends locally into said local void and has a portion that is covered by the optical element and an uncovered portion that is located beyond the edge of the optical element.