ADHESIVE COMPOSITION

Provided is an adhesive composition having high adhesiveness to polyamides.An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4) :(meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1...

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Bibliographische Detailangaben
Hauptverfasser:	SASAKI, Makiko, NAKAJIMA, Gosuke, HOSHINO, Takako
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DYES GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is an adhesive composition having high adhesiveness to polyamides.An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4) :(meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3) :a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group;a (meth)acrylate (1-2) having a hydroxy group; anda (meth)acrylate (1-3) represented by general formula (A);an acidic phosphate compound (2);a polymerization initiator (3); anda reducing agent (4) comprising a transition metal salt.