ELECTRONIC SYSTEM COMPRISING A MICROELECTROMECHANICAL SYSTEM AND A BOX ENCAPSULATING THIS MICROELECTROMECHANICAL SYSTEM

ELECTRONIC SYSTEM COMPRISING A MICROELECTROMECHANICAL SYSTEM AND A BOX ENCAPSULATING THIS MICROELECTROMECHANICAL SYSTEM

The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Rougeot, Claude, Hodot, Romain, LEVERRIER, Bertrand, Sarno, Claude
Format: Patent
Sprache:eng
Schlagworte:
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.