LATENT CURE RESINS AND RELATED METHODS
The present disclosure relates generally to curable resins, in particular latent cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present disclosure relates generally to curable resins, in particular latent cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device. |
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