LATENT CURE RESINS AND RELATED METHODS

The present disclosure relates generally to curable resins, in particular latent cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.

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Bibliographische Detailangaben
Hauptverfasser: Kimyonok, Alpay, Zieringer, Maximilian
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present disclosure relates generally to curable resins, in particular latent cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.