Apparatus and Method For Laser Processing A Material

Apparatus (10) for laser processing a material (11), which apparatus comprises a laser (1) and a beam delivery cable (2), wherein: the laser (1) is connected to the beam delivery cable (2); the beam delivery cable (2) is configured to transmit laser radiation (13) emitted from the laser (1), and the...

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Bibliographische Detailangaben
Hauptverfasser:	Harrison, Paul Martin, Codemard, Andrè Christophe, Greenwood, Mark, Malinowski, Andrew, Zervas, Mikhail Nickolaos
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Apparatus (10) for laser processing a material (11), which apparatus comprises a laser (1) and a beam delivery cable (2), wherein: the laser (1) is connected to the beam delivery cable (2); the beam delivery cable (2) is configured to transmit laser radiation (13) emitted from the laser (1), and the laser radiation (13) is defined by a beam parameter product (4); and the apparatus (10) is characterized in that: the apparatus (10) includes at least one squeezing mechanism (5) comprising a periodic surface (6) defined by a pitch (7); a length (8) of optical fibre (9) that forms part of the laser (1) and/or the beam delivery cable (2) is located adjacent to the periodic surface (6); and the squeezing mechanism (5) is configured to squeeze the periodic surface (6) and the length (8) of the optical fibre (9) together with a squeezing force (12); whereby the beam parameter product (4) is able to be varied by adjusting the squeezing force (12).