METHOD FOR ETCHING ETCH LAYER

METHOD FOR ETCHING ETCH LAYER

A method includes rotating a wafer, dispensing a liquid from a center of the wafer to an edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liquid is dispensed through a nozzle.

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Bibliographische Detailangaben
Hauptverfasser: CHOU, Bo-Wei, HUANG, Ping-Jung, KU, Wen-Yu, YU, Pi-Chun, SHIH, Jui-Ming, SINGH, Manish Kumar
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method includes rotating a wafer, dispensing a liquid from a center of the wafer to an edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liquid is dispensed through a nozzle.