MECHANICAL FAILURE MONITORING, DETECTION, AND CLASSIFICATION IN ELECTRONIC ASSEMBLIES

MECHANICAL FAILURE MONITORING, DETECTION, AND CLASSIFICATION IN ELECTRONIC ASSEMBLIES

Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicativ...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: McCoy, David C, Malatkar, Pramod, Yazzie, Kyle, Yagnamurthy, Naga Sivakumar, Neerukatti, Rajesh Kumar, Prieto, Frank P
Format: Patent
Sprache:eng
Schlagworte:
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicatively coupled to the acoustic sensor, wherein the acoustic sensor is to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.