SUBSTRATE CUTTING DEVICE
A substrate cutting device includes: a base portion; a stage on the base portion; a partition member spaced from the stage; and an exhausting structure below the cell substrate and configured to exhaust a gaseous substance. The stage has a top surface configured to support a cell substrate and a con...
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| creator | SIM, Junho NOH, Sungho SHIM, Hyungbo KIM, Buemjoon KIM, Jihoon KANG, Kyungwon KIM, Teadong LEE, Heesuk KIM, Woong HAN, Jaeku |
| description | A substrate cutting device includes: a base portion; a stage on the base portion; a partition member spaced from the stage; and an exhausting structure below the cell substrate and configured to exhaust a gaseous substance. The stage has a top surface configured to support a cell substrate and a connection surface perpendicular to the top surface, and the partition member faces the connection surface and is configured to support the cell substrate. |
| format | Patent |
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The stage has a top surface configured to support a cell substrate and a connection surface perpendicular to the top surface, and the partition member faces the connection surface and is configured to support the cell substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING HAND CUTTING TOOLS PERFORMING OPERATIONS SEVERING TRANSPORTING |
| title | SUBSTRATE CUTTING DEVICE |
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