SUBSTRATE CUTTING DEVICE

A substrate cutting device includes: a base portion; a stage on the base portion; a partition member spaced from the stage; and an exhausting structure below the cell substrate and configured to exhaust a gaseous substance. The stage has a top surface configured to support a cell substrate and a con...

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Bibliographische Detailangaben
Hauptverfasser:	SIM, Junho, NOH, Sungho, SHIM, Hyungbo, KIM, Buemjoon, KIM, Jihoon, KANG, Kyungwon, KIM, Teadong, LEE, Heesuk, KIM, Woong, HAN, Jaeku
Format:	Patent
Sprache:	eng
Schlagworte:	CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING HAND CUTTING TOOLS PERFORMING OPERATIONS SEVERING TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate cutting device includes: a base portion; a stage on the base portion; a partition member spaced from the stage; and an exhausting structure below the cell substrate and configured to exhaust a gaseous substance. The stage has a top surface configured to support a cell substrate and a connection surface perpendicular to the top surface, and the partition member faces the connection surface and is configured to support the cell substrate.