POLISHING LIQUID COMPOSITION

The present disclosure relates to a polishing composition containing; cerium oxide particles A; a polysaccharide B having a weight average molecular weight of 800 or more and 2800 or less; and water.

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Bibliographische Detailangaben
1. Verfasser:	DOI, Haruhiko
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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Beschreibung
Zusammenfassung:	The present disclosure relates to a polishing composition containing; cerium oxide particles A; a polysaccharide B having a weight average molecular weight of 800 or more and 2800 or less; and water.