SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Processing liquid is stored by a supply tank. The dissolved oxygen concentration of the processing liquid is measured. The dissolved oxygen concentration of the processing liquid in the supply tank is adjusted by supplying concentration adjusting gas having a concentration of inert gas higher than t...

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Bibliographische Detailangaben
1. Verfasser:	NEGORO, Sei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEMICONDUCTOR DEVICES SEPARATION TRANSPORTING
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Beschreibung
Zusammenfassung:	Processing liquid is stored by a supply tank. The dissolved oxygen concentration of the processing liquid is measured. The dissolved oxygen concentration of the processing liquid in the supply tank is adjusted by supplying concentration adjusting gas having a concentration of inert gas higher than that of air into the supply tank in accordance with the dissolved oxygen concentration of the processing liquid measured. The processing liquid in the supply tank is supplied to a substrate. The processing liquid that has been supplied to the substrate is collected to the supply tank. Unnecessary gas that is a gas other than the concentration adjusting gas and dissolved in the processing liquid during the processing of the substrate is decreased from the processing liquid before the processing liquid is collected to the supply tank.