MODULAR PLUG CONNECTOR WITH MULTILAYER PCB FOR VERY HIGH SPEED APPLICATIONS

A modular RJ45-type plug apparatus is provided for forming a connector interface with a connector jack in a high speed data transmission network. A housing comprises an insulative front portion and a conductive shield portion attachable to define an interior, within which is positioned a contact subassembly including a first PCB having cable mounting pads on one end and through holes for elongate plug contacts on the other end. The contacts are connected on one end to the first PCB and on a second end to a second PCB, with bridge portions therebetween collectively defining a jack contact interface. The second PCB comprises desired electrical characteristics which provide the apparatus with certain capacitance compensation properties, wherein the capacitance compensation is offset from a signal path defined between the jack-plug connector interface and the cable pairs.