SEMICONDUCTOR DEVICE

A semiconductor device includes a first semiconductor chip formed with an IGBT, a second semiconductor chip formed with a MOSFET, a first metal member electrically connected to a collector electrode and a drain electrode, and a second metal member electrically connected to an emitter electrode and a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	NAGASE, Takuo
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor device includes a first semiconductor chip formed with an IGBT, a second semiconductor chip formed with a MOSFET, a first metal member electrically connected to a collector electrode and a drain electrode, and a second metal member electrically connected to an emitter electrode and a source electrode. The IGBT and the MOSFET connected in parallel to each other are turned on in the order of the IGBT and the MOSFET, and turned off in the order of the MOSFET and the IGBT. The second metal member has a main body portion on which the first and second semiconductor chips are mounted, and a joint portion as a terminal portion connected to the main body portion. In a plan view, a shortest distance between the joint portion and the first semiconductor chip is shorter than a shortest distance between the joint portion and the second semiconductor chip.