POWER MODULE
For a power module comprising at least three levels stacked one above another, including: at least one heat sink (10) having a top side (11), at least one adhesion-promoting intermediate layer (20) applied to the top side (11) of the heat sink (10) and extending in a planar fashion and having a firs...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | For a power module comprising at least three levels stacked one above another, including: at least one heat sink (10) having a top side (11), at least one adhesion-promoting intermediate layer (20) applied to the top side (11) of the heat sink (10) and extending in a planar fashion and having a first side (21), which faces the top side (11) of the heat sink (10), and a second side (22), which faces away from the first side (21), at least one metallic layer (30) arranged on the second side (22) of the intermediate layer (20) and subdivided into conductor track sections (31) and having a contact side (32), which faces the second side (22) of the intermediate layer (20), wherein the power module furthermore comprises at least one electronic power component (40) which is applied to at least one conductor track section (31) of the metallic layer (30) and is electrically contacted electrically with the at least one conductor track section (31) of the metallic layer (30), it is proposed that the metallic layer (30) subdivided into conductor track sections (31) is produced from at least one metal sheet subdivided into conductor track sections (31) independently of the production of the intermediate layer (20) and the heat sink (10). |
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