CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION AND PATTERN FORMING METHOD USING SAME

The present invention relates to a photosensitive resin composition suitable for forming a thick film, which comprises (A) an alkali-soluble resin, (B) at least one plasticizer selected from a group consisting of an alkali-soluble vinyl resin and an acid-dissociable group containing vinyl resin, (C)...

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Bibliographische Detailangaben
Hauptverfasser: KAWATO, Shunji, KATAYAMA, Tomohide, AKASHI, Kazumichi, SUZUKI, Masato, TAKAICHI, TETSUMASA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to a photosensitive resin composition suitable for forming a thick film, which comprises (A) an alkali-soluble resin, (B) at least one plasticizer selected from a group consisting of an alkali-soluble vinyl resin and an acid-dissociable group containing vinyl resin, (C) an acid generator, and (D) an organic solvent.