POSITIVE RELIEF FORMING OF POLYCRYSTALLINE DIAMOND STRUCTURES AND RESULTING CUTTING TOOLS

POSITIVE RELIEF FORMING OF POLYCRYSTALLINE DIAMOND STRUCTURES AND RESULTING CUTTING TOOLS

Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrysta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Miess, David P
Format: Patent
Sprache:eng
Schlagworte:
GRINDING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Beschreibung
Zusammenfassung:Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.