MAGNETIC SHIELDING OF STT-MRAM IN MULTICHIP PACKAGING AND METHOD OF MANUFACTURING THE SAME

MAGNETIC SHIELDING OF STT-MRAM IN MULTICHIP PACKAGING AND METHOD OF MANUFACTURING THE SAME

Methodologies and an apparatus for enabling magnetic shielding of stand alone MRAM are provided. Embodiments include placing MRAM dies and logic dies on a first surface of a mold frame; forming a top magnetic shield over top and side surfaces of the MRAM dies; forming a mold cover over the MRAM dies...

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Bibliographische Detailangaben
Hauptverfasser: TAN, Juan Boon, JUNG, Boo Yang, YI, Wanbing, SHUM, Danny Pak-Chum, BHUSHAN, Bharat
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Beschreibung
Zusammenfassung:Methodologies and an apparatus for enabling magnetic shielding of stand alone MRAM are provided. Embodiments include placing MRAM dies and logic dies on a first surface of a mold frame; forming a top magnetic shield over top and side surfaces of the MRAM dies; forming a mold cover over the MRAM dies, FinFET dies and mold frame; removing the mold frame to expose a bottom surface of the MRAM dies and FinFET dies; and forming a bottom magnetic shield over the bottom surface of the MRAM dies.