SELECTIVE AND MULTILEVEL SOLDER PASTE PIN TRANSFER

Embodiments include a paste transfer tool (PTT), a semiconductor package, and a method of forming the semiconductor package with the paste transfer tool. The PTT includes a top surface and a bottom surface. The PTT also includes one or more pins, where each pin has a first end and a second end, and...

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Bibliographische Detailangaben
Hauptverfasser:	AMIR, Dudi, MOKLER, Scott
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Embodiments include a paste transfer tool (PTT), a semiconductor package, and a method of forming the semiconductor package with the paste transfer tool. The PTT includes a top surface and a bottom surface. The PTT also includes one or more pins, where each pin has a first end and a second end, and where the first end is disposed on the body and the second end has a nozzle tip. The method of forming the semiconductor package includes dipping the nozzle tip of the PTT in a paste reservoir to form paste dots on the nozzle tip; disposing the paste dots on one or more pads of a substrate with the PTT; and forming one or more bumps from the on paste dots on the one or more pads of the substrate, where the pads of the substrate are positioned on one or more regions of the substrate.