METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT

METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT

A method of producing an optoelectronic component includes providing a carrier; arranging a structured reflector above a top side of the carrier; arranging an optoelectronic semiconductor chip including a top side and an underside opposite the top side in an opening of the reflector, wherein the und...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Gebuhr, Tobias, Pindl, Markus
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of producing an optoelectronic component includes providing a carrier; arranging a structured reflector above a top side of the carrier; arranging an optoelectronic semiconductor chip including a top side and an underside opposite the top side in an opening of the reflector, wherein the underside of the optoelectronic semiconductor chip faces the top side of the carrier; arranging an embedding material above the top side of the carrier, wherein the optoelectronic semiconductor chip is at least partly embedded into the embedding material, as a result of which a composite body including the optoelectronic semiconductor chip, the reflector and the embedding material is formed; and detaching the composite body from the carrier.