TRANSFER CHAMBERS WITH AN INCREASED NUMBER OF SIDES, SEMICONDUCTOR DEVICE MANUFACTURING PROCESSING TOOLS, AND PROCESSING METHODS

TRANSFER CHAMBERS WITH AN INCREASED NUMBER OF SIDES, SEMICONDUCTOR DEVICE MANUFACTURING PROCESSING TOOLS, AND PROCESSING METHODS

A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at le...

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Bibliographische Detailangaben
Hauptverfasser: Kuchar, Michael, Kankanala, Penchala N, Mazzocco, John J, Meyers, Michael, Koshti, Sushant S, Englhardt, Eric A, Rice, Michael Robert, Hruzek, Dean C
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.