Apparatus for Manufacturing Semiconductors

An apparatus for manufacturing semiconductors is provided by which adhesion of moisture to a wafer in an EFEM is easily prevented. The apparatus 1 for manufacturing the semiconductors comprises processing equipment 30 that processes a wafer 90, a FOUP 40 that supplies the wafer 90 and that houses th...

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Bibliographische Detailangaben
Hauptverfasser:	HONBORI, Isao, KISAKIBARU, Toshiro, UENO, Kouta, SUGIYAMA, Satoki
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL HANDLING THIN OR FILAMENTARY MATERIAL METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	An apparatus for manufacturing semiconductors is provided by which adhesion of moisture to a wafer in an EFEM is easily prevented. The apparatus 1 for manufacturing the semiconductors comprises processing equipment 30 that processes a wafer 90, a FOUP 40 that supplies the wafer 90 and that houses the wafer 90 that has been processed, an EFEM 10 that transfers the wafer 90 between the FOUP 40 and the processing equipment 30, a fan and filter unit 20 that sends an airflow 72 from above to the EFEM 10, an ultrasonic oscillator 52 that generates high-frequency power, and a vibrator 54 that generates ultrasonic waves 80 by using the high-frequency power that is generated by the ultrasonic oscillator 52 and that applies the ultrasonic waves 80 to the wafer 90 that is transported in the EFEM 10 and that has been processed.