EPOXY-MODIFIED VINYL COPOLYMER, THERMOPLASTIC RESIN COMPOSITION INCLUDING SAID COPOLYMER, AND SHAPED ARTICLE OF SAID COMPOSITION

An epoxy-modified vinyl copolymer (A) includes 0.1 to 95 parts by mass of an epoxy group-containing vinyl monomer and 5 to 99.9 parts by mass of one or more vinyl monomers selected from aromatic vinyl monomers, vinyl cyanide monomers and additional vinyl monomers copolymerizable with these monomers,...

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Bibliographische Detailangaben
1. Verfasser:	FUKAMACHI, Yusuke
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	An epoxy-modified vinyl copolymer (A) includes 0.1 to 95 parts by mass of an epoxy group-containing vinyl monomer and 5 to 99.9 parts by mass of one or more vinyl monomers selected from aromatic vinyl monomers, vinyl cyanide monomers and additional vinyl monomers copolymerizable with these monomers, the copolymer having a weight average molecular weight Mw of 50,000 to 300,000 and an epoxy equivalent of 150 to 143,000 g/eq. A thermoplastic resin composition includes the epoxy-modified vinyl copolymer (A) and a thermoplastic resin (C) such as a thermoplastic polyester resin (B). A shaped article includes the thermoplastic resin.