HEAT DISSIPATION SYSTEM OF ENCLOSED ELECTRONIC MODULE WITH SINGLE/MULTIPLE ACTIVE COMPONENTS

The present disclosure relates to an enclosed electronic module with single/multiple active components and an integrated heat dissipation system, including a top housing formed with one or more openings, a heat sink mounted on an outer surface of the top housing over the opening(s) thereof, a bottom housing coupled with the top housing, one or more active components mounted on a PCB between the top and bottom housings, and at least one thermal block or vapor chamber thermally connected between the heat sink and the active component(s), thereby forming one or more thermal dissipation paths extending from the active component(s), through the at least one thermal block or vapor chamber, and to the heat sink.