FLEXIBLE TRANSMITTER CIRCUITRY FOR INTEGRATED CIRCUITS

A multichip package may include a transmitter die and a receiver mounted on a substrate. The transmitter die may be coupled to the receiver die through die-to-die connections such as microbumps and conductive paths in the substrate. The transmitter die may include flexible transmitter circuitry having transceiver logic and driver circuitry. The driver circuitry may include a high-swing driver and a low-swing driver optionally equalization circuitry. The driver circuitry may operable in a high-swing mode, a low-swing mode with equalization, and a low-swing mode without equalization. Transmitter circuitry provided in this way removes undesirable DC voltage paths to ground present in other driving schemes to reduce power consumption while still meeting bandwidth, flexibility, and scalability demands.