THERMOSETTING RESIN COMPOSITION, METAL-CLAD LAMINATED PLATE, INSULATING SHEET, PRINTED WIRING BOARD, METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND PACKAGE SUBSTRATE

A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KISHINO, Koji, HOSHINO, Yasunori, SHIRAKI, Hiroyuki, OBATA, Shimpei, TAMIYA, Hiroki, ARAKAWA, Shinya, TAKAHASHI, Ryuji, YAMADA, Takahiro, FUJITA, Shigetoshi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.