CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF CERAMIC ELECTRONIC DEVICE

A ceramic electronic device includes: a multilayer chip including a multilayer structure and cover layers, the multilayer structure having a structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer chip, a main component of the plurality of dielectric layers being a ceramic, the cover layers being provided on an upper face and a lower face of the multilayer structure in a stacking direction; and a pair of external electrodes that are formed on the two edge faces, wherein each of the external electrodes has a smaller thickness on a corner portion of the cover layers, has a crook toward the internal electrode layers, and has a larger thickness on an area of the two edge faces where the internal electrode layers are extracted.