SEMICONDUCTOR ASSEMBLY

An assembly is provided that includes a semiconductor device positioned on a frame and connected to electroplated traces via wire bonding. A connector can be integrated into the frame. Terminals can be molded into the frame. Traces can be connected to the terminals so as to provide a three-dimension...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MCGOWAN, Daniel B, ZADEREJ, Victor
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE NON-PORTABLE LIGHTING DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS
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Beschreibung
Zusammenfassung:	An assembly is provided that includes a semiconductor device positioned on a frame and connected to electroplated traces via wire bonding. A connector can be integrated into the frame. Terminals can be molded into the frame. Traces can be connected to the terminals so as to provide a three-dimensional circuit.